Described herein are a polyamide composition and a molded article comprising such polyamide composition, such as a mobile electronic device component. The polyamide composition comprises a polyamide polymer, an electrically conductive material comprising carbon fibers, carbon nano-tubes, or any combination thereof, and a glass filler having tri-dimensional structures characterized by an average length of at most 500 microns, said glass filler comprising at least 20 wt % glass flakes. The polyamide composition and the molded article exhibit near-isotropic mold shrinkage, low warpage and near-isotropic CLTE (Coefficient of Linear Thermal Expansion) and are electrostatic dissipative (ESD).