Invention Publication
- Patent Title: POLYPHENYLENE SULFIDE RESIN COMPOSITION AND MOLDED PRODUCT FORMED FROM SAME
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Application No.: US18283672Application Date: 2022-03-15
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Publication No.: US20240166875A1Publication Date: 2024-05-23
- Inventor: Tomohiro Hirase , Hiroyuki Isago , Takeshi Unohara , Shunsuke Horiuchi
- Applicant: Toray Industries, Inc.
- Applicant Address: JP Tokyo
- Assignee: Toray Industries, Inc.
- Current Assignee: Toray Industries, Inc.
- Current Assignee Address: JP Tokyo
- Priority: JP 21054867 2021.03.29 JP 22006985 2022.01.20
- International Application: PCT/JP2022/011571 2022.03.15
- Date entered country: 2023-09-22
- Main IPC: C08L81/02
- IPC: C08L81/02 ; F16L11/04

Abstract:
A polyphenylene sulfide resin composition includes (a) a polyphenylene sulfide resin and (b) a silicone-based polymer; the content of the component (b) is not less than 3 parts by weight and not more than 40 parts by weight with respect to 100 parts by weight of the component (a); in terms of morphology (phase structure), the polyphenylene sulfide resin composition has a phase-separated structure wherein the component (a) forms a continuous phase and the component (b) forms a dispersed phase in which the component (b) is dispersed with a number average dispersion diameter of not more than 3.0 μm; a test specimen obtained by injection molding of the polyphenylene sulfide resin composition at a cylinder temperature of 310° C. and a mold temperature of 145° C. has a flexural modulus of not more than 3.0 GPa as determined by a flexural test according to ISO 178.
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