Invention Publication
- Patent Title: METHODS FOR 3D TENSOR BUILDER FOR INPUT TO MACHINE LEARNING
-
Application No.: US18510234Application Date: 2023-11-15
-
Publication No.: US20240169210A1Publication Date: 2024-05-23
- Inventor: Kan Tan , John J. Pickerd
- Applicant: Tektronix, Inc.
- Applicant Address: US OR Beaverton
- Assignee: Tektronix, Inc.
- Current Assignee: Tektronix, Inc.
- Current Assignee Address: US OR Beaverton
- Main IPC: G06N3/09
- IPC: G06N3/09

Abstract:
A test and measurement instrument includes a port to connect to a device under test (DUT) to receive waveform data, a connection to a machine learning network, and one or more processors configured to: receive one or more inputs about a three-dimensional (3D) tensor image; scale the waveform data to fit within the 3D tensor image; build the 3D tensor image; send the 3D tensor image to the machine learning network; and receive a predictive result from the machine learning network. A method includes receiving waveform data from one or more device under test (DUT), receiving one or more inputs about a three-dimensional (3D) tensor image, scaling the waveform data to fit within the 3D tensor image, building the 3D tensor image, sending the 3D tensor image to a pre-trained machine learning network, and receiving a predictive result from the machine learning network.
Information query