Invention Publication
- Patent Title: SEMICONDUCTOR STRUCTURE
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Application No.: US18424888Application Date: 2024-01-29
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Publication No.: US20240170490A1Publication Date: 2024-05-23
- Inventor: BO TAO , Li Wang , Ching-Yang Wen , Purakh Raj Verma , Zhibiao Zhou , Dong Yin , Gang Ren , Jian Xie
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu City
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu City
- Priority: CN 2111073572.9 2021.09.14
- Main IPC: H01L27/12
- IPC: H01L27/12 ; G11C17/16 ; H01L23/525 ; H10B20/20 ; H10B20/25

Abstract:
A semiconductor structure includes a semiconductor on insulator (SOI) substrate, a first electrically conductive structure, and a second electrically conductive structure. The SOI substrate includes a base substrate, a buried insulation layer disposed on the base substrate, a semiconductor layer disposed on the buried insulation layer, and a trap rich layer disposed between the buried insulation layer and the base substrate. At least a part of the first electrically conductive structure and at least a part of the second electrically conductive structure are disposed in the trap rich layer. A part of the trap rich layer is disposed between the first electrically conductive structure and the second electrically conductive structure. The first electrically conductive structure, the second electrically conductive structure, and the trap rich layer disposed between the first electrically conductive structure and the second electrically conductive structure are at least a portion of an anti-fuse structure.
Public/Granted literature
- US6898P Rhododendron plane-Irvsmart variety Public/Granted day:1989-07-04
Information query
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