Invention Publication
- Patent Title: ELECTRONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME
-
Application No.: US18427788Application Date: 2024-01-30
-
Publication No.: US20240170829A1Publication Date: 2024-05-23
- Inventor: Jenchun CHEN , Ya-Wen LIAO
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Main IPC: H01Q1/22
- IPC: H01Q1/22 ; H01L23/66 ; H01Q1/40 ; H01Q1/42 ; H01Q9/04 ; H01Q21/06 ; H01Q21/08

Abstract:
The present disclosure provides an electronic package. The electronic package includes an antenna structure having a first antenna and a second antenna at least partially covered by the first antenna. The electronic package also includes a directing element covering the antenna structure. The directing element has a first portion configured to direct a first electromagnetic wave having a first frequency to transmit via the first antenna and a second portion configured to direct a second electromagnetic wave having a second frequency different from the first frequency to transmit via the second antenna. A method of manufacturing an electronic package is also provided.
Information query