公开(公告)号：US20250133322A1

公开(公告)日：2025-04-24

申请号：US19006183

申请日：2024-12-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang Yi WU ,  Hung Yi LIN ,  Jenchun CHEN

IPC: H04R1/10

Abstract: The present disclosure provides a wearable component. The wearable component includes a first carrier and a first electronic component at least partially embedded within the first carrier. The first carrier and the first electronic component define a space configured for audio transmission. An ear tip and a method of manufacturing a wearable component are also provided.

公开(公告)号：US20230269866A1

公开(公告)日：2023-08-24

申请号：US17680069

申请日：2022-02-24

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei-Jhen CIOU ,  Jenchun CHEN ,  Chang-Fu LU ,  Pai-Sheng SHIH

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0271 ,  H05K1/181 ,  H05K2201/10098

Abstract: An electronic device is provided. The electronic device includes a carrier, a first electronic component, a second electronic component, and an encapsulant. The first electronic component is disposed at a first side of the carrier. The second electronic component is disposed at a second side of the carrier opposite to the first side. The encapsulant encapsulates the first electronic component and has an uneven thickness. The encapsulant is configured to reduce a warpage of the carrier.

公开(公告)号：US20220328960A1

公开(公告)日：2022-10-13

申请号：US17225045

申请日：2021-04-07

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jenchun CHEN ,  Ya-Wen LIAO

IPC: H01Q3/24 ,  H01Q1/22 ,  H01Q1/42

Abstract: The present disclosure provides an antenna module including a substrate, a first antenna disposed on the substrate and a second antenna disposed on the substrate and spaced apart from the first antenna. The first antenna is configured to have a first operating frequency and the second antenna is configured to have a second operating frequency different from the first operating frequency. The antenna module further includes an element configured to focus an electromagnetic wave transmitted or received by the first antenna and the second antenna. A semiconductor device package is also disclosed.

公开(公告)号：US20210036194A1

公开(公告)日：2021-02-04

申请号：US16529569

申请日：2019-08-01

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jenchun CHEN

IPC: H01L33/56 ,  H01L33/54 ,  H01L51/52

Abstract: A tape includes at least one tape unit. The tape unit includes a base structure having a first portion and a second portion. The first portion has a first surface and a second surface opposite to the first surface. The second portion protrudes from the second surface of the first portion, and has a third surface opposite to the first surface of the first portion and a lateral surface extending between the second surface and the third surface. An area of the first portion from a top view is greater than an area of the second portion from a top view.

公开(公告)号：US20250096213A1

公开(公告)日：2025-03-20

申请号：US18369108

申请日：2023-09-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jenchun CHEN ,  Pai-Sheng SHIH ,  Kuan-Fu CHEN ,  Cheng Kai CHANG

IPC: H01L25/16

Abstract: An optical package structure is provided. The optical package structure includes a carrier, an optical emitter, an optical receiver, an optical barrier, and an insulating structure. The optical emitter and the optical receiver are over the carrier. The optical barrier is over the carrier and between the optical emitter and the optical receiver, wherein the optical barrier defines a cavity. The insulating structure is filled in the cavity, wherein an elevation of a top surface of the insulating structure is lower than an elevation of a top surface of the optical barrier with respect to a surface of the carrier.

公开(公告)号：US20240272365A1

公开(公告)日：2024-08-15

申请号：US18108488

申请日：2023-02-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shyue-Long LOUH ,  Jenchun CHEN

IPC: G02B6/293 ,  G02B6/42

CPC classification number: G02B6/29395 ,  G02B6/4214 ,  G02B6/4215

Abstract: An optical module is disclosed. The optical module includes a carrier, a first optical receiver disposed over the carrier and configured to receive a first light of a first wavelength band, and a second optical receiver disposed over the carrier and configured to receive a second light of a second wavelength band different from the first wavelength band. The optical module also includes a light blocking structure having a first portion around the first optical receiver and the second optical receiver. The light blocking structure is substantially opaque to the first wavelength band and the second wavelength band. The optical module also includes a first optical filter disposed over the first optical receiver and configured to allow the first light to pass through, and a second optical filter disposed over the second optical receiver and configured to allow the second light to pass through.

公开(公告)号：US20230327336A1

公开(公告)日：2023-10-12

申请号：US17716922

申请日：2022-04-08

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jenchun CHEN ,  Shyue-Long LOUH

IPC: H01Q5/307

CPC classification number: H01Q5/307

Abstract: An electronic device is disclosed. The electronic device includes a carrier and a first interposer disposed on the carrier. The first interposer has a first region configured for providing an external electrical connection to outside the electronic device and a second region distinct from the first region. The electronic device also includes a first antenna component disposed on the second region of the first interposer.

公开(公告)号：US20230086019A1

公开(公告)日：2023-03-23

申请号：US18071593

申请日：2022-11-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jenchun CHEN ,  Ya-Wen LIAO

IPC: H01Q19/09 ,  H01Q3/24 ,  H01Q1/42 ,  H01Q1/22

Abstract: The present disclosure provides an antenna module including a substrate, a first antenna disposed on the substrate and a second antenna disposed on the substrate and spaced apart from the first antenna. The first antenna is configured to have a first operating frequency and the second antenna is configured to have a second operating frequency different from the first operating frequency. The antenna module further includes an element configured to focus an electromagnetic wave transmitted or received by the first antenna and the second antenna. A semiconductor device package is also disclosed.

公开(公告)号：US20230199362A1

公开(公告)日：2023-06-22

申请号：US17560179

申请日：2021-12-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang Yi WU ,  Hung Yi LIN ,  Jenchun CHEN

IPC: H04R1/10

CPC classification number: H04R1/1016 ,  H04R1/1058 ,  H04R1/1091

Abstract: The present disclosure provides a wearable component. The wearable component includes a first carrier and a first electronic component at least partially embedded within the first carrier. The first carrier and the first electronic component define a space configured for audio transmission. An ear tip and a method of manufacturing a wearable component are also provided.

公开(公告)号：US20230187387A1

公开(公告)日：2023-06-15

申请号：US18109787

申请日：2023-02-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jenchun CHEN ,  An-Ping CHIEN

IPC: H01L23/66 ,  H01L23/498 ,  H01L21/48 ,  H01Q1/38 ,  H01L23/552

CPC classification number: H01L23/66 ,  H01L23/49838 ,  H01L21/4846 ,  H01Q1/38 ,  H01L23/552 ,  H01L2223/6677

Abstract: A semiconductor device package includes a substrate and a shielding layer. The substrate has a first surface, a second surface opposite to the first surface and a first lateral surface extending between the first surface and the second surface. The substrate has an antenna pattern disposed closer to the second surface than the first surface. The shielding layer extends from the first surface toward the second surface of the substrate. The shielding layer covers a first portion of the first lateral surface adjacent to the first surface of the substrate. The shielding layer exposes a second portion of the first lateral surface adjacent to the second surface of the substrate.