Invention Publication
- Patent Title: METHOD FOR FORMING POWER MODULE PACKAGE, POWER MODULE PACKAGE AND ELECTRONIC DEVICE
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Application No.: US18372441Application Date: 2023-09-25
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Publication No.: US20240172375A1Publication Date: 2024-05-23
- Inventor: Quansong Luo , Yanbing Xia , Yanggui Feng , Xi Liu , Kaijian Yang , Liang Jin
- Applicant: Delta Electronics, Inc.
- Applicant Address: TW Taoyuan City
- Assignee: Delta Electronics, Inc.
- Current Assignee: Delta Electronics, Inc.
- Current Assignee Address: TW Taoyuan City
- Priority: CN 2211467476.7 2022.11.22
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K3/32 ; H05K3/34

Abstract:
A method for forming a power module package includes providing a power module including an electrical element and an electrical connection portion; providing an electrical connection terminal including a connection end, an extension portion and an end cap, wherein the extension portion is extended between the connection end and the end cap and has a hollow cavity therein; disposing the electrical connection terminal on the electrical connection portion for electrically connecting the connection end to a corresponding electrical connection portion; packaging the power module and the electrical connection terminal through an encapsulant to form a packaged body; removing a portion of a surface of the packaged body for exposing the end cap of the electrical connection terminal; and removing the end cap to expose the hollow cavity of the electrical connection terminal, so as to form the power module package.
Information query