One or more semiconductor dice are arranged on a die pad of a leadframe having an array of electrically conductive leads around the die pad. A pattern of electrically conductive wires is provided to couple the semiconductor die or dice with electrically conductive leads in the array around the die pad. An encapsulation of insulating material is provided to encapsulate the semiconductor die or dice arranged on the die pad and the pattern of electrically conductive wires. Providing the encapsulation comprises: a first encapsulation step wherein a first mass of encapsulation material is transferred onto the semiconductor die or dice arranged on the die pad and onto the pattern of electrically conductive wires to form a core portion of the encapsulation that fully encapsulates the die or dice and the electrically conductive wires, that are thus retained in position by the first mass of encapsulation material, and a second encapsulation step wherein a second mass of encapsulation material is molded onto the core portion of the encapsulation to provide a shell portion of the encapsulation around the core portion of the encapsulation.