Invention Publication
- Patent Title: PLACEMENT BOARD AND PLACEMENT STRUCTURE
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Application No.: US18284928Application Date: 2022-02-04
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Publication No.: US20240178049A1Publication Date: 2024-05-30
- Inventor: Naoya Kida , Jun Futakutiya , Daisuke Fujino , Naoya Aikawa , Keiko Wada , Aya Nakajima
- Applicant: NHK Spring Co., Ltd.
- Applicant Address: JP Yokohama-shi
- Assignee: NHK Spring Co., Ltd.
- Current Assignee: NHK Spring Co., Ltd.
- Current Assignee Address: JP Yokohama-shi
- Priority: JP 21058621 2021.03.30
- International Application: PCT/JP2022/004526 2022.02.04
- Date entered country: 2023-09-29
- Main IPC: H01L21/687
- IPC: H01L21/687 ; H05B3/18 ; H05B3/30
Abstract:
A placement board includes: a main body unit configured to form a flow channel for circulation of a medium for heat exchange and place a workpiece thereon, the main body unit being made of a metallic material; and a heater provided in an outer edge region of the main body unit. A temperature difference between the outer edge region and an inner region of the main body unit at a surface of the main body unit where the workpiece is placed is 20° C. or more in a state where the medium has been caused to circulate through the flow channel.
Information query
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