Invention Publication
- Patent Title: SEMICONDUCTOR DEVICE
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Application No.: US18378182Application Date: 2023-10-10
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Publication No.: US20240178138A1Publication Date: 2024-05-30
- Inventor: Yong Jin SHIN , Dong Woo KIM , Mun Jun KIM , Jun Kwan KIM , On Yu BAE , Kyoung Min WOO
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR 20220162693 2022.11.29
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H01L21/768 ; H01L23/532

Abstract:
A semiconductor device includes a substrate having a cell region and a peripheral region surrounding the cell region, a lower electrode extending in a vertical direction on the cell region of the substrate, an upper electrode surrounding a sidewall and a top surface of the lower electrode, a capacitor dielectric layer disposed between the lower electrode and the upper electrode, a first barrier layer disposed on the upper electrode, the first barrier layer in contact with each of a sidewall and a top surface of the upper electrode, a first interlayer insulating layer covering the first barrier layer, the first interlayer insulating layer including a material different from the first barrier layer, and a first contact penetrating through the first barrier layer and the first interlayer insulating layer in the vertical direction, the first contact connected to the upper electrode.
Information query
IPC分类: