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公开(公告)号:US20240196598A1
公开(公告)日:2024-06-13
申请号:US18527470
申请日:2023-12-04
发明人: Jun Kwan KIM , Dong Woo KIM , Mun Jun KIM , On Yu BAE , Yong Jin SHIN , Kyoung Min WOO
IPC分类号: H10B12/00
CPC分类号: H10B12/34 , H10B12/033 , H10B12/053 , H10B12/315
摘要: A semiconductor device is provided. The semiconductor device includes a substrate containing deuterium at a first concentration, an active pattern disposed on the substrate and extending in a first horizontal direction, a gate electrode disposed on the active pattern and extending in a second horizontal direction different from the first horizontal direction, a gate insulating layer disposed between the active pattern and the gate electrode, the gate insulating layer containing deuterium at a second concentration, a first interlayer insulating layer disposed on the gate electrode, a second interlayer insulating layer disposed on the first interlayer insulating layer, and a wiring pattern disposed inside the second interlayer insulating layer, the wiring pattern containing deuterium at a third concentration lower than the first concentration, wherein each of the first to third concentrations is a concentration of deuterium atoms contained in the same unit volume.
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公开(公告)号:US20240178138A1
公开(公告)日:2024-05-30
申请号:US18378182
申请日:2023-10-10
发明人: Yong Jin SHIN , Dong Woo KIM , Mun Jun KIM , Jun Kwan KIM , On Yu BAE , Kyoung Min WOO
IPC分类号: H01L23/528 , H01L21/768 , H01L23/532
CPC分类号: H01L23/528 , H01L21/76832 , H01L21/76841 , H01L23/53223 , H01L28/90
摘要: A semiconductor device includes a substrate having a cell region and a peripheral region surrounding the cell region, a lower electrode extending in a vertical direction on the cell region of the substrate, an upper electrode surrounding a sidewall and a top surface of the lower electrode, a capacitor dielectric layer disposed between the lower electrode and the upper electrode, a first barrier layer disposed on the upper electrode, the first barrier layer in contact with each of a sidewall and a top surface of the upper electrode, a first interlayer insulating layer covering the first barrier layer, the first interlayer insulating layer including a material different from the first barrier layer, and a first contact penetrating through the first barrier layer and the first interlayer insulating layer in the vertical direction, the first contact connected to the upper electrode.
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