An example semiconductor package comprises a semiconductor die having a top surface, a passivation layer over the top surface, a first metal layer on the first passivation layer, an antenna formed in the first metal layer and offset from the semiconductor die, the antenna having a slot bow-tie configuration, a transmission line formed in the first metal layer, the transmission line coupling the semiconductor die to the antenna, and an insulating material separating the first metal layer from a second metal layer, the second metal layer configured to function as a ground reflector for the antenna. The second metal layer may extend below the antenna and the semiconductor die.