Invention Publication
- Patent Title: SENSOR PACKAGE WITH LOW ASPECT RATIO THROUGH SILICON VIA
-
Application No.: US17994446Application Date: 2022-11-28
-
Publication No.: US20240178164A1Publication Date: 2024-05-30
- Inventor: Masamitsu Matsuura , Kengo Aoya , Daiki Komatsu , Ko Shibata
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/768 ; H01L23/48
Abstract:
An electronic device includes a semiconductor substrate having a first conductive routing structure on a first side of the semiconductor substrate, and a low aspect ratio via opening extending from the first side to an opposite second side. The electronic device includes a transparent cover over a portion of the first side and covering the patterned first conductive routing structure, as well as an insulator layer including a photo-imageable material on the second side and along a sidewall of the via opening, and a second conductive routing structure on an outer side of the insulator layer and extending through the via opening and directly contacting a portion of the first conductive routing structure.
Information query
IPC分类:
