公开(公告)号：US20240178164A1

公开(公告)日：2024-05-30

申请号：US17994446

申请日：2022-11-28

Applicant: Texas Instruments Incorporated

Inventor： Masamitsu Matsuura ,  Kengo Aoya ,  Daiki Komatsu ,  Ko Shibata

IPC: H01L23/00 ,  H01L21/768 ,  H01L23/48

CPC classification number: H01L24/05 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/02 ,  H01L24/04 ,  H01L24/13 ,  H01L24/94 ,  H01L27/144

Abstract: An electronic device includes a semiconductor substrate having a first conductive routing structure on a first side of the semiconductor substrate, and a low aspect ratio via opening extending from the first side to an opposite second side. The electronic device includes a transparent cover over a portion of the first side and covering the patterned first conductive routing structure, as well as an insulator layer including a photo-imageable material on the second side and along a sidewall of the via opening, and a second conductive routing structure on an outer side of the insulator layer and extending through the via opening and directly contacting a portion of the first conductive routing structure.