A radio-frequency module includes a module substrate including a first major surface opposite to a second major surface, a plurality of electronic components disposed at the first major surface and at the second major surface, and a power supply terminal disposed at the second major surface. The plurality of electronic components include an integrated circuit disposed at the second major surface and including a control circuit coupled to the power supply terminal. The plurality of electronic components also include a capacitor disposed at the second major surface and coupled between a path connecting the power supply terminal to the control circuit and ground. The integrated circuit is disposed closer to the capacitor than any other electronic component disposed at the second major surface and/or the capacitor is disposed closer to the integrated circuit than any other electronic component disposed at the second major surface.