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公开(公告)号：US20240187029A1
公开(公告)日：2024-06-06
申请号：US18442117
申请日：2024-02-15
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yukiya YAMAGUCHI , Hiroki SHOUNAI , Atsushi HORITA
CPC classification number: H04B1/38 , H04B1/0078
Abstract: A radio-frequency module includes a module substrate having major surfaces that are opposite to each other, a plurality of electronic components disposed at the major surface and at the major surface, and a plurality of post electrodes that are disposed at the major surface and that include a power supply terminal. The plurality of electronic components includes an integrated circuit that is disposed at the major surface and that includes a control circuit coupled to the power supply terminal. The plurality of electronic components also include a capacitor that is disposed at the major surface and that is coupled between the path connecting the power supply terminal to the control circuit and ground. The power supply terminal is disposed closer to the capacitor than any other post electrodes; and/or the capacitor is disposed closer to the power supply terminal than any other electronic component disposed at the major surface.
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公开(公告)号：US20220109409A1
公开(公告)日：2022-04-07
申请号：US17644137
申请日：2021-12-14
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Atsushi HORITA
Abstract: A high-frequency module and a communication device capable of suppressing deterioration of a noise figure of a low-noise amplifier are provided. A high-frequency module (1) includes a mounting substrate (2), a low-noise amplifier (12), an input switch (20), and a matching circuit (30). The input switch (20) is connected to an input terminal of the low-noise amplifier (12). The matching circuit (30) performs impedance matching between the input switch (20) and the low-noise amplifier (12). The matching circuit (30) is disposed on a first main surface (21) in a first direction (Dl) of the mounting substrate (2). The input switch (20) and the low-noise amplifier (12) are disposed on a second main surface (22) opposed to the first main surface (21). When the mounting substrate (2) is viewed in plan, the input switch (20) overlaps at least a part of the matching circuit (30).
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公开(公告)号：US20240178204A1
公开(公告)日：2024-05-30
申请号：US18434842
申请日：2024-02-07
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yukiya YAMAGUCHI , Atsushi HORITA , Hiroki SHOUNAI
IPC: H01L25/16 , H01L23/498 , H03F3/19
CPC classification number: H01L25/16 , H01L23/49811 , H03F3/19 , H03F2200/294 , H03F2200/451
Abstract: A radio-frequency module includes a module substrate including a first major surface opposite to a second major surface, a plurality of electronic components disposed at the first major surface and at the second major surface, and a power supply terminal disposed at the second major surface. The plurality of electronic components include an integrated circuit disposed at the second major surface and including a control circuit coupled to the power supply terminal. The plurality of electronic components also include a capacitor disposed at the second major surface and coupled between a path connecting the power supply terminal to the control circuit and ground. The integrated circuit is disposed closer to the capacitor than any other electronic component disposed at the second major surface and/or the capacitor is disposed closer to the integrated circuit than any other electronic component disposed at the second major surface.
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公开(公告)号：US20210135693A1
公开(公告)日：2021-05-06
申请号：US17075710
申请日：2020-10-21
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Atsushi HORITA
Abstract: A radio frequency module includes a mounting board, a low noise amplifier, a reception filter, and an input matching circuit. The low noise amplifier is mounted on the mounting board. The reception filter is connected to the low noise amplifier. The input matching circuit is provided on a signal path between the reception filter and the low noise amplifier. The input matching circuit includes at least one inductor. The reception filter is disposed on the low noise amplifier. The at least one inductor included in the input matching circuit is adjacent to the low noise amplifier such that no other circuit element is present between the low noise amplifier and the at least one inductor.
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公开(公告)号：US20190326938A1
公开(公告)日：2019-10-24
申请号：US16378669
申请日：2019-04-09
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Atsushi HORITA
Abstract: A front-end module includes a substrate, and a receiving circuit that is provided in or on the substrate and in which CA is executed. The receiving circuit includes a first filter, a first inductor, and a first LNA disposed on a first path, and a second filter, a second inductor, and a second LNA disposed on a second path. A coil axis of the first inductor and a coil axis of the second inductor are different from each other.
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Patent Agency Ranking
6.发明申请公开(公告)号：US20190158062A1
公开(公告)日：2019-05-23
申请号：US16251257
申请日：2019-01-18
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Atsushi HORITA , Koji NOSAKA
CPC classification number: H03H9/6483 , H03H7/0161 , H03H7/075 , H03H9/605 , H03H9/6403 , H04B1/0057 , H04B1/40
Abstract: A filter (11) includes a series-arm circuit (10) connected between an input/output terminal (11m) and an input/output terminal (11n); and a parallel-arm circuit (20) connected between a ground and a path that connects the input/output terminal (11m) and the input/output terminal (11n). One circuit among the series-arm circuit (10) and the parallel-arm circuit (20) is constituted by a parallel-arm resonator (p1) and a parallel-arm resonator (p2) that are connected in parallel to each other and that are connected to a node (x1) on the path. The parallel-arm resonators (p1) and (p2) form a pass band, together with another circuit among the series-arm circuit (10) and the parallel-arm circuit (20). The parallel-arm resonator (p2) has a resonant frequency lower than a resonant frequency of the parallel-arm resonator (p1) and has an impedance higher than an impedance of the parallel-arm resonator (p1).
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公开(公告)号：US20240372510A1
公开(公告)日：2024-11-07
申请号：US18736619
申请日：2024-06-07
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Atsushi HORITA
Abstract: A radio frequency module capable of suppressing a situation where a power supply wiring unit electromagnetically interferes with an amplifier inside a semiconductor integrated circuit. The radio frequency module includes a mounting substrate, a semiconductor integrated circuit, and a power supply wiring unit. The semiconductor integrated circuit is arranged at the mounting substrate. The semiconductor integrated circuit includes a first amplifier, a second amplifier, and a power supply electrode. The first amplifier includes a first power supply terminal. The second amplifier includes a second power supply terminal. A power supply voltage from the mounting substrate is input to the power supply electrode. The power supply wiring unit connects the power supply electrode to the first power supply terminal and the second power supply terminal.
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公开(公告)号：US20210336639A1
公开(公告)日：2021-10-28
申请号：US17368958
申请日：2021-07-07
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Motoji TSUDA , Yusuke NANIWA , Morio TAKEUCHI , Atsushi HORITA , Jin YOKOYAMA , Sho MATSUMOTO , Syunsuke KIDO , Yukiya YAMAGUCHI , Hiroyuki KANI
Abstract: A radio-frequency module includes a transmission path which has one end connected to a transmission terminal and on which a transmission signal in Band A is transmitted; a reception path (62) which has one end connected to a reception terminal (120B) and on which a reception signal in Band B is transmitted; a reception path (63) which has one end connected to a reception terminal (120C) and on which a reception signal in Band C is transmitted; a switch (11) having a common terminal (11a) and selection terminals (11b and 11c); and a switch (12) having a common terminal (12a) and selection terminals (12b and 12c).
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公开(公告)号：US20210314010A1
公开(公告)日：2021-10-07
申请号：US17351867
申请日：2021-06-18
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Motoji TSUDA , Yukiya YAMAGUCHI , Sho MATSUMOTO , Hiroyuki KANI , Atsushi HORITA , Morio TAKEUCHI , Yusuke NANIWA , Jin YOKOYAMA
Abstract: A radio-frequency module includes a switch performing switching of the connection between a common terminal and a selection terminal, a reception filter having a reception band in a band A as a passband, a transmission filter that has a transmission band in a band B as a passband and has an output terminal connected to the selection terminal, a filter that has the transmission band in a band B as an attenuation band and has an input terminal connected to the selection terminal, a reception path which connects the selection terminal and an input terminal of the reception filter and on which the filter is disposed, a bypass path which connects the selection terminal and the input terminal of the reception filter and on which no filter is disposed, and a transmission path which connects the selection terminal and a transmission terminal and on which the transmission filter is disposed.
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10.发明申请公开(公告)号：US20190214970A1
公开(公告)日：2019-07-11
申请号：US16354276
申请日：2019-03-15
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Atsushi HORITA , Koji NOSAKA
Abstract: An acoustic wave filter device includes a first resonant circuit, a second resonant circuit, a first interconnect line, and a second interconnect line. The second resonant circuit includes a second parallel-arm resonator, and a frequency-tuning circuit that allows tuning of the resonant frequency of the second parallel-arm resonator. The frequency-tuning circuit includes a capacitor, and a switching element connected in parallel with the capacitor. The first interconnect line is an interconnect line connected to the portion of the series-arm resonator located adjacent to the first input/output terminal. The second interconnect line is an interconnect line connecting the parallel-arm resonator with the switching element, or an interconnect line connecting the parallel-arm resonator with the capacitor. A first transmission line formed by the first interconnect line, and a second transmission line formed by the second interconnect line are magnetically coupled with each other.
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