Invention Publication
- Patent Title: ARRAY SUBSTRATE, METHOD FOR MANUFACTURING THE ARRAY SUBSTRATE AND DISPLAY PANEL
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Application No.: US17789505Application Date: 2021-06-24
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Publication No.: US20240178238A1Publication Date: 2024-05-30
- Inventor: Dongfang WANG , Ce NING , Guangcai YUAN
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- International Application: PCT/CN2021/102051 2021.06.24
- Date entered country: 2022-06-27
- Main IPC: H01L27/12
- IPC: H01L27/12

Abstract:
An array substrate includes: a base; gate lines and data lines on the base; multiple pixel units each including a thin film transistor; first and second conductive layers with a first insulating layer therebetween. The first conductive layer includes a first wiring pattern, the second conductive layer includes a first interconnection pattern, orthographic projections of the first wiring pattern and the first interconnection pattern on the base are at least partially overlapped. The first wiring pattern is connected with the first interconnection pattern through a via hole. Each of part of data lines is located in the first conductive layer and has an auxiliary line formed by the first interconnection pattern in the second conductive layer. The first wiring pattern includes the data lines; at least one of the data line and the first interconnection pattern is connected to a source of the thin film transistor.
Information query
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