Invention Publication
- Patent Title: MULTILEVEL SEMICONDUCTOR DEVICE AND STRUCTURE WITH IMAGE SENSORS AND WAFER BONDING
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Application No.: US18432035Application Date: 2024-02-04
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Publication No.: US20240178257A1Publication Date: 2024-05-30
- Inventor: Zvi Or-Bach , Deepak C. Sekar , Brian Cronquist
- Applicant: Monolithic 3D Inc.
- Applicant Address: US OR Klamath Falls
- Assignee: Monolithic 3D Inc.
- Current Assignee: Monolithic 3D Inc.
- Current Assignee Address: US OR Klamath Falls
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L23/48 ; H01L23/544

Abstract:
An integrated device, the device including: a first level including a first mono-crystal layer, the first mono-crystal layer including a plurality of single crystal transistors; an overlying oxide disposed on top of the first level; a second level including a second mono-crystal layer, the second level overlaying the oxide, where the second mono-crystal layer includes a plurality of image sensors, where the second level is bonded to the first level including an oxide to oxide bond; a plurality of pixel control circuits; a third level disposed underneath the first level, where the third level includes a plurality of third transistors, where the plurality of third transistors each include a single crystal channel; and a plurality of memory circuits.
Public/Granted literature
- US12080743B2 Multilevel semiconductor device and structure with image sensors and wafer bonding Public/Granted day:2024-09-03
Information query
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