A radio-frequency module includes a module substrate having major surfaces that are opposite to each other, a plurality of electronic components disposed at the major surface and at the major surface, and a plurality of post electrodes that are disposed at the major surface and that include a power supply terminal. The plurality of electronic components includes an integrated circuit that is disposed at the major surface and that includes a control circuit coupled to the power supply terminal. The plurality of electronic components also include a capacitor that is disposed at the major surface and that is coupled between the path connecting the power supply terminal to the control circuit and ground. The power supply terminal is disposed closer to the capacitor than any other post electrodes; and/or the capacitor is disposed closer to the power supply terminal than any other electronic component disposed at the major surface.