Camera device structures and methods of manufacturing them are disclosed. A sensor core includes a housing, a camera sensor, an integrated readout circuit, a controller (e.g., a processor unit for image processing), and a ceramic package base. In some examples, the sensor core includes a semiconductor-based micro machined cavity structure (e.g., based on an enclosure formed via the housing) with an integrated lens of the camera core package. The disclosure provides for a camera sensing core package with high reflection coating around walls of the housing, apart from the bottom ceramic base, which allows for maximum or rejection of stray radiation. The thermally balanced properties of the structure provide for improved thermal stability of the camera core of the device, while ensuring near zero thermal gradient across the camera sensor, which may result in improved performance of the camera sensing core.