A semiconductor device assembly is provided that includes a cooling system. The semiconductor device assembly includes a semiconductor die assembled onto a substrate. A channel is disposed at a back side of the semiconductor die to enable fluid to flow through the channel and cause heat to transfer from the semiconductor die to the fluid. The fluid is received through an inlet to enable the fluid to be flowed through the channel. After the fluid is flowed through the channel, the fluid is expelled through an outlet. In this way, a compact and effective cooling system for a semiconductor device assembly may be implemented.