公开(公告)号：US12068055B2

公开(公告)日：2024-08-20

申请号：US17899417

申请日：2022-08-30

Applicant: Micron Technology, Inc.

Inventor： Abhilash Ramamurthy Nag ,  Suresh Reddy Yarragunta ,  Shiva Pahwa

IPC: G11C7/10 ,  G06F11/30 ,  G06N20/00 ,  G11C29/00 ,  G11C29/52

CPC classification number: G11C7/1096 ,  G06F11/3058 ,  G06N20/00 ,  G11C7/1093 ,  G11C29/00 ,  G11C29/52 ,  G11C2207/2245 ,  G11C2207/229

Abstract: Exemplary methods, apparatuses, and systems include an environmental operations manager for controlling memory access of the memory device. The environmental operations manager receives a set of data bits for programming to a memory location. The environmental operations manager receives environmental condition data. The environmental operations manager delays programming of the set of data bits to the memory location and writing the set of data bits to a buffer location in response to determining that the environmental condition data satisfies a threshold.

公开(公告)号：US20240196569A1

公开(公告)日：2024-06-13

申请号：US18533024

申请日：2023-12-07

Applicant: Micron Technology, Inc.

Inventor： Suresh Reddy Yarragunta ,  Deepu Narasimiah Subhash

IPC: H05K7/20

CPC classification number: H05K7/20509

Abstract: Methods, systems, and devices for thermal isolation for memory systems are described. The enclosed heatsink architectures may impede heat transfer from a first group of components to a second group components. Some examples include a partition (an air gap or other thermally insulating material) between multiple heatsinks. The heatsinks may each have heat transfer elements with various structures. In some examples, a first heatsink may overlap a second heatsink. The overlapping architecture may increase the size of the heatsink corresponding to the first set of components and increase their rate of heat exchange. In some examples, the heatsink architecture may include upper heatsinks and lower heatsinks. The enclosed heatsink architectures may reduce device overheating and time spent in thermal throttling, as well as improve the life expectancy, durability, efficiency, and performance of the memory devices. Increased efficiency in cooling the device may save energy costs.

公开(公告)号：US20240061487A1

公开(公告)日：2024-02-22

申请号：US18233594

申请日：2023-08-14

Applicant: Micron Technology, Inc.

Inventor： Abhilash Ramamurthy Nag ,  Shiva Pahwa ,  Suresh Reddy Yarragunta

IPC: G06F1/30 ,  G06F1/26 ,  G06F3/06

CPC classification number: G06F1/30 ,  G06F1/263 ,  G06F3/0626 ,  G06F3/0629 ,  G06F3/0679

Abstract: Aspects of the present disclosure configure a memory sub-system processor, to use a thermoelectric generator during a power loss event. The processor delivers power to a set of memory components from a power source. The processor detects a power failure event associated with the power source and, in response to detecting the power failure event, receives holdup power from the thermoelectric generator. The processor delivers the holdup power from the thermoelectric generator to the set of memory components.

公开(公告)号：US20250028448A1

公开(公告)日：2025-01-23

申请号：US18772878

申请日：2024-07-15

Applicant: Micron Technology, Inc.

Inventor： Kyle J. Wilkins ,  Suresh Reddy Yarragunta ,  Deepu Narasimiah Subhash ,  Koneri Sathyanarayana Guptha Amith

IPC: G06F3/06

Abstract: Aspects of the present disclosure configure a memory sub-system processor to use a thermally conductive material (TCM) to improve thermal energy storage and heat dissipation to improve a data transfer rate. The TCM surrounds the set of memory components and the processing device and is configured to dissipate heat from the processing device and the set of memory components.

公开(公告)号：US20240268077A1

公开(公告)日：2024-08-08

申请号：US18597310

申请日：2024-03-06

Applicant: Micron Technology, Inc.

Inventor： Suresh Reddy Yarragunta ,  Deepu Narasimiah Subhash ,  Ravi Kumar Kollipara

IPC: H05K7/20

CPC classification number: H05K7/20409

Abstract: Aspects of the present disclosure are directed to a memory sub-system with isothermal cooling of components. A PCB assembly may be secured between a heat spreader and a heat sink that are thermally coupled. The heat sink radiates heat absorbed from both sides of the PCB assembly. By connecting the heat spreader to the heat sink, heat is more effectively transferred from the side of the PCB assembly not directly connected to the heat sink. The PCB assembly may be secured between a top enclosure and a bottom enclosure. The top enclosure and the bottom enclosure may be thermally coupled using a vapor chamber. The vapor chamber pumps heat from a higher-temperature side of the PCB assembly to a lower-temperature side of the PCB assembly. By using the vapor chamber to thermally couple the top and bottom enclosures, creation of hot spots is avoided.

公开(公告)号：US20240172355A1

公开(公告)日：2024-05-23

申请号：US18387195

申请日：2023-11-06

Applicant: Micron Technology, Inc.

Inventor： Suresh Reddy Yarragunta ,  Deepu Narasiah Subhash

IPC: H05K1/02 ,  H05K3/30

CPC classification number: H05K1/0206 ,  H05K3/30 ,  G06F1/206

Abstract: Aspects of the present disclosure configure a memory sub-system processor to use a fin stack to improve heat dissipation to improve a data transfer rate. The processor measures temperature of at least one of the processing device or the set of memory components. The processor accesses a reference temperature for controlling data transfer rate between a host and the set of memory components. The processor compares the measured temperature with the reference temperature and, based on the comparison, adjusts the data transfer rate based on comparing the measured temperature with the reference temperature.

公开(公告)号：US20240074110A1

公开(公告)日：2024-02-29

申请号：US18239427

申请日：2023-08-29

Applicant: Micron Technology, Inc.

Inventor： Shiva Pahwa ,  Abhiash Ramamurthy Nag ,  Suresh Reddy Yarragunta

IPC: H05K7/20 ,  F28F3/04 ,  G06F1/20

CPC classification number: H05K7/20336 ,  F28F3/048 ,  G06F1/20 ,  H05K7/20409

Abstract: Example embodiments are directed to an input/output (IO) bracket that may be used in a solid-state drive (SSD), the IO bracket comprises a faceplate and at least one heat pipe coupled to the faceplate that extends horizontally from a surface of the faceplate. The at least one heat pipe is configured to be coupled to a controller of the SSD in order to transfer heat from the controller out of the SSD. By coupling the controller to the heat pipe instead of a main heatsink, the main heatsink can efficiently dissipate heat from remaining components of the SSD.

公开(公告)号：US20240194565A1

公开(公告)日：2024-06-13

申请号：US18514763

申请日：2023-11-20

Applicant: Micron Technology, Inc.

Inventor： Ravi Kumar Kollipara ,  Suresh Reddy Yarragunta

IPC: H01L23/473 ,  H01L21/56 ,  H01L25/18 ,  H10B80/00

CPC classification number: H01L23/473 ,  H01L21/56 ,  H01L25/18 ,  H10B80/00 ,  H01L24/16

Abstract: A semiconductor device assembly is provided that includes a cooling system. The semiconductor device assembly includes a semiconductor die assembled onto a substrate. A channel is disposed at a back side of the semiconductor die to enable fluid to flow through the channel and cause heat to transfer from the semiconductor die to the fluid. The fluid is received through an inlet to enable the fluid to be flowed through the channel. After the fluid is flowed through the channel, the fluid is expelled through an outlet. In this way, a compact and effective cooling system for a semiconductor device assembly may be implemented.

公开(公告)号：US20240172398A1

公开(公告)日：2024-05-23

申请号：US18385191

申请日：2023-10-30

Applicant: Micron Technology, Inc.

Inventor： Deepu Narasimiah Subhash ,  Suresh Reddy Yarragunta ,  Koneri Sathyanarayana Guptha Amith

IPC: H05K7/20 ,  G06F1/20 ,  H05K1/02

CPC classification number: H05K7/205 ,  G06F1/206 ,  H05K1/0215 ,  H05K7/20509 ,  H05K1/18 ,  H05K2201/09163

Abstract: Aspects of the present disclosure configure a memory sub-system processor to use a triangular shaped metal bracket to improve heat dissipation to improve a data transfer rate. The triangular shaped metal bracket being physically attached to an edge of the PCB at a base portion of the triangular shaped metal bracket. The triangular shaped metal bracket is thermally coupled to the set of memory components and the processing device of the PCB via the base portion along with a heat spreader on a primary and secondary side of the bracket. The triangular shaped metal bracket being configured to dissipate heat from the processing device and the set of memory components to at least a host device through a vertex portion of the triangular shaped metal bracket.

公开(公告)号：US20240114660A1

公开(公告)日：2024-04-04

申请号：US18374421

申请日：2023-09-28

Applicant: Micron Technology, Inc.

Inventor： Suresh Reddy Yarragunta ,  Koneri Sathyanarayana Guptha Amith ,  Deepu Narasimiah Subhash

IPC: H05K7/20 ,  H05K5/00 ,  H05K5/02

CPC classification number: H05K7/2039 ,  H05K5/0047 ,  H05K5/0213

Abstract: Example embodiments are directed to a solid-state drive (SSD) enclosure design that is adaptable for different printed circuit board assemblies (PCBA). The SSD enclosure design comprises a three-piece construction that includes a top enclosure, a bottom enclosure, and an intermediate structure. The bottom enclosure is coupled to the top enclosure to form a housing for a PCBA having NOT AND (NAND) devices and a controller. The intermediate structure is coupled to the PCBA and positioned between the top enclosure and the bottom enclosure within the housing. The intermediate structure comprises a plurality of heatsinks to transfer heat from the NAND devices and a controller heatsink to transfer heat from the controller, whereby the type and location of the heatsinks can be changed for a different PCBA without having to change the top enclosure or bottom enclosure. The top enclosure can include vents that allow air to flow through.