- 专利标题: CONNECTOR MODULE WITH IMPROVED HEAT DISSIPATION PERFORMANCE
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申请号: US18225489申请日: 2023-07-24
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公开(公告)号: US20240195100A1公开(公告)日: 2024-06-13
- 发明人: Kunlin YAO , Rongzhe GUO , Chenhui ZENG , Ruoyi ZHANG , Henning HANSEN
- 申请人: DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD
- 申请人地址: CN Dongguan City
- 专利权人: DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD
- 当前专利权人: DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD
- 当前专利权人地址: CN Dongguan City
- 优先权: CN 2211593083.0 2022.12.13
- 主分类号: H01R12/75
- IPC分类号: H01R12/75 ; H01R13/518 ; H01R13/6471 ; H01R13/6585
摘要:
A connector module includes a bracket and at least one cable connector. The bracket includes a first bracket and a second bracket. The first bracket defines at least one receiving groove. The first bracket includes an opening surrounded by a number of side walls. The second bracket is of a frame-shaped configuration, and includes a central opening extending therethrough along a vertical direction. The cable connector includes a body, a number of conductive terminals and a cable. The body is at least partially received in the receiving groove. The conductive terminals are configured to engage with the conductive elements of a circuit board. The circuit board is at least partially clamped between the first bracket and the second bracket. The circuit board is configured to mount a chip which is exposed in the opening.
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