CONNECTOR MODULE WITH IMPROVED HEAT DISSIPATION PERFORMANCE
摘要:
A connector module includes a bracket and at least one cable connector. The bracket includes a first bracket and a second bracket. The first bracket defines at least one receiving groove. The first bracket includes an opening surrounded by a number of side walls. The second bracket is of a frame-shaped configuration, and includes a central opening extending therethrough along a vertical direction. The cable connector includes a body, a number of conductive terminals and a cable. The body is at least partially received in the receiving groove. The conductive terminals are configured to engage with the conductive elements of a circuit board. The circuit board is at least partially clamped between the first bracket and the second bracket. The circuit board is configured to mount a chip which is exposed in the opening.
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