发明公开
- 专利标题: POLYAMIC ACID COMPOSITION
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申请号: US18287642申请日: 2022-04-22
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公开(公告)号: US20240204194A1公开(公告)日: 2024-06-20
- 发明人: Se Joo PARK , In Hwan HWANG , Ik Sang LEE
- 申请人: PI ADVANCED MATERIALS CO., LTD.
- 申请人地址: KR Chungcheongbuk-do
- 专利权人: PI ADVANCED MATERIALS CO., LTD.
- 当前专利权人: PI ADVANCED MATERIALS CO., LTD.
- 当前专利权人地址: KR Chungcheongbuk-do
- 优先权: KR 20210052321 2021.04.22
- 国际申请: PCT/KR2022/095090 2022.04.22
- 进入国家日期: 2023-10-19
- 主分类号: H01M4/62
- IPC分类号: H01M4/62 ; C08G69/42 ; C08G69/48
摘要:
The present application relates to a polyamic acid composition, a binder resin composition for an electrode, an electrode active material composition comprising the binder resin composition, and an electrode comprising same, and provides a novel binder material which has excellent mechanical strength and excellent binding force by synthesizing polyamic acid and applying same as a silicone-based negative electrode binder.
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