A method of manufacturing a wearable device comprising a printed circuit board (PCB) on which is mounted electronic components, the method includes providing a mould attaching the PCB to a cage, the cage comprising a cage body and at least one hole, inserting said PCB into the mould; arresting the PCB relative to the mould by inserting an insert tool into the mould and attaching the insert tool to said at least one hole, injecting a wet applied structural component into said mould and removing said mould.