Invention Publication
- Patent Title: MICROFLUIDIC SUBSTRATE, MICROFLUIDIC CHIP AND MICROFLUIDIC SYSTEM
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Application No.: US17908067Application Date: 2021-09-02
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Publication No.: US20240207852A1Publication Date: 2024-06-27
- Inventor: Bolin FAN , Wenliang YAO , Yingying ZHAO , Le GU , Yongjia GAO , Qiuxu WEI , Li YANG
- Applicant: Beijing BOE Sensor Technology Co., Ltd. , BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: Beijing BOE Sensor Technology Co., Ltd.,BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: Beijing BOE Sensor Technology Co., Ltd.,BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- International Application: PCT/CN2021/116325 2021.09.02
- Date entered country: 2023-03-09
- Main IPC: B01L3/00
- IPC: B01L3/00

Abstract:
A microfluidic substrate has a first straight region, a second straight region, and a first turning region, which is substantially of a ring sector and includes a first arc edge and a second arc edge that are opposite. The microfluidic substrate includes first straight driving electrodes in the first straight region, second straight driving electrodes in the second straight region, and turning driving electrodes the first turning region. A border of each turning driving electrode includes at least one first reference point coinciding with the first arc edge and at least one second reference point coinciding with the second arc edge. A radius of the first arc edge is greater than or equal to (√{square root over (3)}−1) times of a first dimension of a reference electrode, and a radius of the second arc edge is greater than or equal to 3/2 times of the first dimension of the reference electrode.
Information query
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