- 专利标题: SOLVENT FREE BATTERY PRINTING SYSTEM AND PROCESS
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申请号: US18392794申请日: 2023-12-21
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公开(公告)号: US20240208138A1公开(公告)日: 2024-06-27
- 发明人: Steven Zhichao SHI , Morteza VATANI
- 申请人: Sakuu Corporation
- 申请人地址: US CA San Jose
- 专利权人: Sakuu Corporation
- 当前专利权人: Sakuu Corporation
- 当前专利权人地址: US CA San Jose
- 主分类号: B29C64/153
- IPC分类号: B29C64/153 ; B29C64/264 ; B33Y10/00 ; B33Y30/00
摘要:
A solvent-free powder bed printing process includes depositing a binder-coated powder on a substrate. The binder-coated powder includes a binder that is either thermally curable or a photocurable composition. Optionally, the deposited layer may be densified by a compaction mechanism. A printed pattern is then formed by defined binder curing. This includes selectively curing the binder-coated powder to form a predetermined printed pattern using at least one of heat or light to cure the thermally curable or photocurable composition, respectively. Accordingly, the printed pattern is transferred to a build station or platform. Thus, binder deposition and subsequent drying and solvent recovery in the conventional binder jetting 3D printing have been eliminated. In some embodiments, further processing may occur on the printed pattern layer prior to transferring.
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