- 专利标题： DUAL-MODE DATACENTER COOLING SYSTEM
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申请号： US18085129申请日： 2022-12-20
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公开(公告)号： US20240215205A1公开(公告)日： 2024-06-27
- 发明人: Pardeep Shahi , Ali Heydari
- 申请人： NVIDIA Corporation
- 申请人地址： US CA Santa Clara
- 专利权人： NVIDIA Corporation
- 当前专利权人： NVIDIA Corporation
- 当前专利权人地址： US CA Santa Clara
- 主分类号： H05K7/20
- IPC分类号： H05K7/20
摘要：
A system includes one or more first cooling loops to cool one or more first components within one or more servers having a first power density, and one or more second cooling loops to cool one or more second components within the one or more servers having a second power density. The system can flow first coolant to cold plates to cool high-power server components and flow second coolant to cool low-power server components by immersion cooling.
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