公开(公告)号：US20240215205A1

公开(公告)日：2024-06-27

申请号：US18085129

申请日：2022-12-20

Applicant: NVIDIA Corporation

Inventor： Pardeep Shahi ,  Ali Heydari

IPC: H05K7/20

CPC classification number: H05K7/20781 ,  H05K7/20236 ,  H05K7/20272 ,  H05K7/20645

Abstract: A system includes one or more first cooling loops to cool one or more first components within one or more servers having a first power density, and one or more second cooling loops to cool one or more second components within the one or more servers having a second power density. The system can flow first coolant to cold plates to cool high-power server components and flow second coolant to cool low-power server components by immersion cooling.

公开(公告)号：US20240098934A1

公开(公告)日：2024-03-21

申请号：US17864989

申请日：2022-07-14

Applicant: NVIDIA Corporation

Inventor： Ali Heydari ,  Pardeep Shahi

IPC: H05K7/20 ,  G01F1/34

CPC classification number: H05K7/20272 ,  G01F1/34 ,  H05K7/20772

Abstract: Systems and methods include pressure sensors that measure a pressure differential of coolant between a first coolant line and a second coolant line. Coolant flow control valves control respective valve flow rates. A processor selects a valve from the flow control valves to provide coolant to a coolant output, responsive to the measured pressure differential.

公开(公告)号：US20230284423A1

公开(公告)日：2023-09-07

申请号：US17688290

申请日：2022-03-07

Applicant: Nvidia Corporation

Inventor： Ali Heydari ,  Pardeep Shahi

IPC: H05K7/20

CPC classification number: H05K7/20836 ,  H05K7/20781

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a first interfacing flow controller includes a sensor and is associated with a first server tray of a rack, so that a first interfacing flow controller can receive sensor inputs and can communicate with a second interfacing flow controller by a communication line there between, where a second interfacing flow controller can be associated with a coolant distribution unit (CDU) to cause a balance of coolant flow to be provided from a CDU to one or more second server trays based in part on a change in a coolant flow to a first server tray as indicated by such sensor inputs.

公开(公告)号：US12069840B2

公开(公告)日：2024-08-20

申请号：US17688290

申请日：2022-03-07

Applicant: Nvidia Corporation

Inventor： Ali Heydari ,  Pardeep Shahi

IPC: H05K7/20

CPC classification number: H05K7/20836 ,  H05K7/20781

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a first interfacing flow controller includes a sensor and is associated with a first server tray of a rack, so that a first interfacing flow controller can receive sensor inputs and can communicate with a second interfacing flow controller by a communication line there between, where a second interfacing flow controller can be associated with a coolant distribution unit (CDU) to cause a balance of coolant flow to be provided from a CDU to one or more second server trays based in part on a change in a coolant flow to a first server tray as indicated by such sensor inputs.

公开(公告)号：US20230371212A1

公开(公告)日：2023-11-16

申请号：US17741108

申请日：2022-05-10

Applicant: Nvidia Corporation

Inventor： Ali Heydari ,  Pardeep Shahi

IPC: H05K7/20

CPC classification number: H05K7/20836 ,  H05K7/202 ,  H05K7/20209 ,  H05K7/20281 ,  H05K7/20409 ,  H05K7/20736

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a primary cooling loop includes at least one primary flow controller to control flow of a primary coolant to a coolant distribution unit (CDU) at a primary flow rate that is determined based in part on heat generated from one or more computing devices that is to be addressed by a secondary coolant, which is to be cooled in a CDU by a primary coolant at a primary flow rate enabled by at least one primary flow controller.