Invention Publication
- Patent Title: THIN-FILM DEPOSITION APPARATUS
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Application No.: US18515664Application Date: 2023-11-21
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Publication No.: US20240218561A1Publication Date: 2024-07-04
- Inventor: Janghwi Lee , Yeontae Kim , Junbum Park , Hunyong Park , Suhwan Park , Sangwoo Bae , Motoshi Sakai , Wondon Joo , Jaeho Jin
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR 20220189382 2022.12.29
- Main IPC: C30B25/16
- IPC: C30B25/16 ; C30B25/12

Abstract:
A thin-film deposition apparatus includes: a housing; a chamber located within the housing and providing an internal space; a platform disposed within the chamber and configured to support a substrate; a reflector disposed within the housing and disposed outside the chamber; a light source disposed between opposing walls of the reflector and configured to radiate light onto the substrate; a light receiver disposed within the housing, spaced apart from the light source with a portion of the reflector therebetween, and having a hole through which light emitted from the substrate is introduced; an optical cable connected to the light receiver and extending to the outside of the housing; and a sensor disposed outside the housing, connected to the optical cable, and configured to measure a temperature of the substrate by analyzing light transmitted from the optical cable.
Information query
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