Invention Publication
- Patent Title: ELECTRONIC COMPONENT AND FILM FORMING METHOD
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Application No.: US18608018Application Date: 2024-03-18
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Publication No.: US20240221981A1Publication Date: 2024-07-04
- Inventor: Tomoya OOSHIMA , Yuuta HOSHINO
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo-shi
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo-shi
- Priority: JP 22137882 2022.08.31
- Main IPC: H01C1/034
- IPC: H01C1/034 ; H01C17/02

Abstract:
An electronic component that includes: a base body having an outer surface, and the outer surface having a recess that is a site recessed with respect to a periphery of the outer surface; and a glass film that covers at least a portion of the outer surface of the base body having the recess, wherein a part of the glass film that covers the recess is recessed with respect to the periphery of the outer surface of the glass film, and a ratio of a minimum value of a thickness of the glass film covering the recess to a maximum value of the thickness is 0.05 to 0.8.
Information query