ELECTRONIC COMPONENT AND FILM FORMING METHOD

    公开(公告)号:US20240221981A1

    公开(公告)日:2024-07-04

    申请号:US18608018

    申请日:2024-03-18

    CPC classification number: H01C1/034 H01C17/02

    Abstract: An electronic component that includes: a base body having an outer surface, and the outer surface having a recess that is a site recessed with respect to a periphery of the outer surface; and a glass film that covers at least a portion of the outer surface of the base body having the recess, wherein a part of the glass film that covers the recess is recessed with respect to the periphery of the outer surface of the glass film, and a ratio of a minimum value of a thickness of the glass film covering the recess to a maximum value of the thickness is 0.05 to 0.8.

    ELECTRONIC COMPONENT
    2.
    发明公开

    公开(公告)号:US20240321487A1

    公开(公告)日:2024-09-26

    申请号:US18671036

    申请日:2024-05-22

    CPC classification number: H01C7/041 H01C1/1413

    Abstract: An electronic component that includes: a base body; a glass film covering at least a part of an outer surface of the base body; and an underlayer electrode covering a part of a surface of the glass film, wherein the base body contains a Mn oxide, the underlayer electrode contains a conductive metal and a glass component, the base body has a reaction layer containing a composite oxide of Mn and the conductive metal at an end portion of the underlayer electrode, and the reaction layer has a void.

    ELECTRONIC COMPONENT
    3.
    发明公开

    公开(公告)号:US20240021347A1

    公开(公告)日:2024-01-18

    申请号:US18475734

    申请日:2023-09-27

    CPC classification number: H01C7/04 H01C1/1413

    Abstract: An electronic component that includes: a base body; and an insulating film covering an outer surface of the base body. The insulating film includes the film main body and a plurality of the thick film portions. A material of the film main body includes a glass. A material of the thick film portion is the same as the glass of the film main body. A thickness of the thick film portion is larger than an average thickness of the film main body.

    ELECTRONIC COMPONENT
    4.
    发明公开

    公开(公告)号:US20240136093A1

    公开(公告)日:2024-04-25

    申请号:US18400627

    申请日:2023-12-29

    CPC classification number: H01C7/043 H01C1/1413

    Abstract: An electronic component that includes: a base body; wiring inside the base body; a glass film covering an outer surface of the base body; an underlying electrode electrically connected to the wiring and covering a part of the glass film; and a metal layer covering the underlying electrode, wherein the glass film includes an uncovered portion that is not covered with the underlying electrode and separated from an outer edge of the underlying electrode by more than 10 μm, and a boundary portion that is not covered with the underlying electrode and not separated from the outer edge of the underlying electrode by more than 10 μm, and a thickness of the boundary portion is larger than a thickness of the uncovered portion.

    COATING PROCESS AND METHOD FOR PRODUCING ELECTRONIC COMPONENT

    公开(公告)号:US20240352277A1

    公开(公告)日:2024-10-24

    申请号:US18762170

    申请日:2024-07-02

    CPC classification number: C09D183/04

    Abstract: A coating process includes adding a body to a reactor; adding a metal alkoxide or precursors thereof to the reactor; adding a catalyst for the hydrolysis of the metal alkoxide to the reactor; and coating the surface of the body with a metal oxide-containing coating layer through the hydrolysis and dehydration condensation of the metal alkoxide. The addition of a body precedes at least one of the addition of a metal alkoxide or precursors thereof and the addition of a catalyst.

    ELECTRONIC COMPONENT
    8.
    发明公开

    公开(公告)号:US20240021346A1

    公开(公告)日:2024-01-18

    申请号:US18475294

    申请日:2023-09-27

    CPC classification number: H01C7/04 H01C1/1413

    Abstract: An electronic component that includes: an element body; and an insulating film covering an outer surface of the element body. The element body has a crack that opens to the outer surface. In a cross section orthogonal to the outer surface, the crack has a first portion that extends from the opening and intersects an axis orthogonal to the outer surface. In addition, one portion of the insulating film penetrates into at least an inner space of the first portion of the crack.

    ELECTRONIC COMPONENT
    9.
    发明申请

    公开(公告)号:US20250118462A1

    公开(公告)日:2025-04-10

    申请号:US18986789

    申请日:2024-12-19

    Abstract: An electronic component includes a base body and a glass film covering an outer surface of the base body. The glass film has a groove extending on an outer surface of the glass film. The groove is recessed from the outer surface of the glass film toward the outer surface side of the base body in a specific section in a direction orthogonal to the outer surface of the glass film. The bottom portion of the groove is located closer to the outer surface side of the glass film than the outer surface of the base body. In addition, the bottom portion of the groove has an arc shape in the specific section.

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