Invention Publication
- Patent Title: MULTILAYER ELECTRONIC COMPONENT
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Application No.: US18231324Application Date: 2023-08-08
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Publication No.: US20240222029A1Publication Date: 2024-07-04
- Inventor: Jong Ho LEE , Kyoung Jin CHA , Berm Ha CHA , Hyung Jong CHOI , Jin Woo CHUN
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR 20220189483 2022.12.29
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/008 ; H01G4/012 ; H01G4/12 ; H01G4/224

Abstract:
A multilayer electronic component includes a body including a capacitance formation portion in which a plurality of dielectric layers and a plurality of internal electrodes are alternately disposed in a first direction, a first cover portion disposed on one surface of the capacitance formation portion in the first direction and including a dielectric layer, and a second cover portion disposed on the other surface of the capacitance formation portion in the first direction and including a dielectric layer; and an external electrode disposed on the body, wherein a molar ratio of Sn/(Ni+Sn) measured in a central portion of an internal electrode disposed closest to the first cover portion or the second cover portion is 0.00160 or more and 0.0230 or less, and a molar ratio of Sn/(Ni+Sn) measured in a central portion of at least one internal electrode, among the plurality of internal electrodes, is 0.00066 or less.
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