MULTILAYER ELECTRONIC COMPONENT
    3.
    发明公开

    公开(公告)号:US20240222029A1

    公开(公告)日:2024-07-04

    申请号:US18231324

    申请日:2023-08-08

    CPC classification number: H01G4/30 H01G4/008 H01G4/012 H01G4/12 H01G4/224

    Abstract: A multilayer electronic component includes a body including a capacitance formation portion in which a plurality of dielectric layers and a plurality of internal electrodes are alternately disposed in a first direction, a first cover portion disposed on one surface of the capacitance formation portion in the first direction and including a dielectric layer, and a second cover portion disposed on the other surface of the capacitance formation portion in the first direction and including a dielectric layer; and an external electrode disposed on the body, wherein a molar ratio of Sn/(Ni+Sn) measured in a central portion of an internal electrode disposed closest to the first cover portion or the second cover portion is 0.00160 or more and 0.0230 or less, and a molar ratio of Sn/(Ni+Sn) measured in a central portion of at least one internal electrode, among the plurality of internal electrodes, is 0.00066 or less.

    CAPACITOR COMPONENT
    5.
    发明申请
    CAPACITOR COMPONENT 审中-公开

    公开(公告)号:US20180233287A1

    公开(公告)日:2018-08-16

    申请号:US15714754

    申请日:2017-09-25

    Abstract: A capacitor component includes a body with a plurality of first and second internal electrodes alternately stacked with dielectric layers interposed therebetween. First and second connection electrodes extend in a thickness direction of the body and are respectively connected to the first and second internal electrodes. First and second lower electrodes are on a lower surface of the body and are respectively connected to the first and second connection electrodes.

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