VIA FUSE WITH METAL-INSULATOR-METAL ARCHITECTURE AND IMPROVED ELECTRODE MATERIAL
摘要:
An apparatus comprising a device layer comprising a plurality of transistors; a first electrode; a second electrode over the first electrode; and a fuse material layer within a via, the via coupling the first and second electrodes together, wherein the fuse material layer is to conduct a non-zero current responsive to a first voltage between the first and second electrodes, and is to form an irreversible open circuit responsive to a second voltage between the first and second electrodes, wherein a magnitude of the second voltage is less than two volts.
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