- 专利标题： SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR
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申请号： US18269172申请日： 2022-01-18
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公开(公告)号： US20240234364A9公开(公告)日： 2024-07-11
- 发明人: Tae Sup CHOI , Woon KANG , Jin Ho YOON
- 申请人： LG INNOTEK CO., LTD.
- 申请人地址： KR Seoul
- 专利权人： LG INNOTEK CO., LTD.
- 当前专利权人： LG INNOTEK CO., LTD.
- 当前专利权人地址： KR Seoul
- 优先权： KR 20210006590 2021.01.18
- 国际申请： PCT/KR2022/000942 2022.01.18
- 进入国家日期： 2023-06-22
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L21/56
摘要：
A semiconductor package comprises: a printed circuit board including a connection portion; an IC chip arranged on the printed circuit board; a solder portion arranged on the lower surface of the IC chip and coupled to the connection portion; a. bonding layer arranged between the solder portion and the connection portion; and an underfill arranged between the IC chip and the printed circuit board, wherein the bonding layer includes thermosetting resin, and the underfill include thermoplastic resin.
公开/授权文献
- US20240136322A1 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR 公开/授权日：2024-04-25
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