公开(公告)号：US20240136322A1

公开(公告)日：2024-04-25

申请号：US18269172

申请日：2022-01-18

申请人： LG INNOTEK CO., LTD.

发明人： Tae Sup CHOI ,  Woon KANG ,  Jin Ho YOON

IPC分类号： H01L23/00 ,  H01L21/56

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81395 ,  H01L2224/81447 ,  H01L2224/8149 ,  H01L2224/81815 ,  H01L2224/81862 ,  H01L2224/81906 ,  H01L2224/83102 ,  H01L2224/83191 ,  H01L2224/8321 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2924/0665 ,  H01L2924/069

摘要： A semiconductor package comprises: a printed circuit board including a connection portion; an IC chip arranged on the printed circuit board; a solder portion arranged on the lower surface of the IC chip and coupled to the connection portion; a. bonding layer arranged between the solder portion and the connection portion; and an underfill arranged between the IC chip and the printed circuit board, wherein the bonding layer includes thermosetting resin, and the underfill include thermoplastic resin.

公开(公告)号：US20240234364A9

公开(公告)日：2024-07-11

申请号：US18269172

申请日：2022-01-18

申请人： LG INNOTEK CO., LTD.

发明人： Tae Sup CHOI ,  Woon KANG ,  Jin Ho YOON

IPC分类号： H01L23/00 ,  H01L21/56

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81395 ,  H01L2224/81447 ,  H01L2224/8149 ,  H01L2224/81815 ,  H01L2224/81862 ,  H01L2224/81906 ,  H01L2224/83102 ,  H01L2224/83191 ,  H01L2224/8321 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2924/0665 ,  H01L2924/069

摘要： A semiconductor package comprises: a printed circuit board including a connection portion; an IC chip arranged on the printed circuit board; a solder portion arranged on the lower surface of the IC chip and coupled to the connection portion; a. bonding layer arranged between the solder portion and the connection portion; and an underfill arranged between the IC chip and the printed circuit board, wherein the bonding layer includes thermosetting resin, and the underfill include thermoplastic resin.

公开(公告)号：US20230027539A1

公开(公告)日：2023-01-26

申请号：US17758368

申请日：2020-12-31

申请人： LG INNOTEK CO., LTD.

发明人： Jin Ho YOON ,  Seung Hyun YANG ,  Tae Sup CHOI

IPC分类号： H01Q3/24 ,  H04B7/06 ,  H04B1/04 ,  H01Q1/32

摘要： A communication apparatus for a vehicle according to an embodiment and a control method therefor are disclosed. The communication apparatus for a vehicle comprises: an antenna unit including a first antenna and a plurality of second antennas; a first switch for switching a first path to the first antenna and a second path to each of the plurality of second antennas; a second switch for switching a second path to any one of the plurality of second antennas; a length adjustment unit that is connected to the second path to the one second antenna connected to the second switch and adjusts the resonance length of the connected second antenna; and a communication control unit that generates a switching signal for connection to any one of the plurality of second antennas according to the state of the first antenna.