Invention Publication
- Patent Title: LASER MACHINING DEVICE AND LASER MACHINING METHOD
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Application No.: US18014819Application Date: 2021-07-13
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Publication No.: US20240238905A1Publication Date: 2024-07-18
- Inventor: Takeshi SAKAMOTO , Katsuhiro KOREMATSU , Takafumi OGIWARA
- Applicant: HAMAMATSU PHOTONICS K.K.
- Applicant Address: JP Hamamatsu-shi, Shizuoka
- Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee Address: JP Hamamatsu-shi, Shizuoka
- Priority: JP 20121659 2020.07.15
- International Application: PCT/JP2021/026343 2021.07.13
- Date entered country: 2023-01-06
- Main IPC: B23K26/38
- IPC: B23K26/38

Abstract:
This laser processing apparatus includes an irradiation unit and a controller. The irradiation unit has a spatial light modulator and a converging part. The controller executes first control for causing the laser light to be modulated by the spatial light modulator such that the laser light is branched into a plurality of rays of processing light and a plurality of converging points of the plurality of rays of processing light are positioned in different positions in a direction perpendicular to an irradiation direction of the laser light. In the first control, the laser light is modulated such that the modified region is present between a converging point of non-modulated light of the laser light and an opposite surface on a side opposite to a laser light incidence surface of the object in the irradiation direction.
Information query
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