This disclosure relates to a combination structure of an output line and a terminal. An output line includes an insulation sleeve and a copper wire. A conducting terminal includes a riveting ring, a conducting ring and a soldering segment connected to one another. The riveting ring is fixed on the insulation sleeve. The conducting ring covers the copper wire. The soldering segment is bent and extended with an included angle with respect to an extending direction of the output line. The output line and the conducting terminal pass through a reflow oven to make the conducting ring and the copper wire be tinned and connected. The insulation seat includes a base and a terminal slot. The soldering segment is embedded in the terminal slot. The circuit board and the conducting terminal pass through the reflow oven to make the soldering segment be tinned and connected to the circuit board.