An electronic package and a manufacturing method thereof are provided, in which a first electronic element and a second electronic element are embedded in a packaging layer, and a circuit structure is formed on the packaging layer and electrically connected to the first electronic element and the second electronic element, where the circuit structure has a heat dissipation portion thermally connected to the first electronic element. Therefore, the heat energy generated by the first electronic element can be quickly dissipated to the outside via the heat dissipation portion, so as to avoid the problem of affecting the operation of the second electronic element due to overheating of the packaging layer.