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公开(公告)号：US20240096835A1
公开(公告)日：2024-03-21
申请号：US18055890
申请日：2022-11-16
发明人： Pin-Jing SU , Liang-Yi HUNG , Yu-Po WANG
IPC分类号： H01L23/00
CPC分类号： H01L24/16 , H01L24/32 , H01L24/73 , H01L2224/02379 , H01L2224/03515 , H01L2224/17519 , H01L2224/24998 , H01L2224/33519 , H01L2224/7525 , H01L2924/16235
摘要： A method of manufacturing an electronic package is provided, in which an electronic element is disposed on a carrier structure; a heat dissipation body of a heat dissipation structure is disposed on the electronic element via a heat dissipation material; the heat dissipation material is cured; supporting legs of the heat dissipation structure are fixed on the carrier structure via a bonding layer; and the bonding layer is cured. Therefore, the heat dissipation structure can be effectively fixed to the heat dissipation material and the bonding layer by completing the arrangements of the heat dissipation material and the bonding layer in stages.
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公开(公告)号：US20240153884A1
公开(公告)日：2024-05-09
申请号：US18148440
申请日：2022-12-30
发明人： Yi-Min FU , Hung-Kai WANG , Chi-Ching HO , Yih-Jenn JIANG , Yu-Po WANG
IPC分类号： H01L23/552 , H01L23/00 , H01L23/31 , H01L23/498
CPC分类号： H01L23/552 , H01L23/3128 , H01L23/49816 , H01L24/16 , H01L24/73 , H01L2224/04105 , H01L2224/12105 , H01L2224/48091 , H01L2924/15311 , H01L2924/181
摘要： An electronic package is provided, in which a first electronic element and a second electronic element stacked on each other are embedded in a cladding layer, a circuit structure electrically connected to the second electronic element is formed on the cladding layer, and a passive element and a package module are disposed on the circuit structure, so as to shorten the transmission distance of electrical signals between the package module and the second electronic element.
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公开(公告)号：US20240274505A1
公开(公告)日：2024-08-15
申请号：US18330233
申请日：2023-06-06
发明人： Shuai-Lin LIU , Nai-Hao KAO , Yu-Po WANG
IPC分类号： H01L23/433 , H01L21/56 , H01L23/00 , H01L25/065 , H01L25/16
CPC分类号： H01L23/4334 , H01L21/561 , H01L21/568 , H01L24/19 , H01L24/20 , H01L25/0655 , H01L25/16 , H01L24/32 , H01L2224/19 , H01L2224/211 , H01L2224/214 , H01L2224/215 , H01L2224/32225 , H01L2924/01029
摘要： An electronic package and a manufacturing method thereof are provided, in which a first electronic element and a second electronic element are embedded in an encapsulation layer, and a circuit structure is disposed on the encapsulation layer and electrically connected to the first electronic element and the second electronic element. The circuit structure has a hollow area corresponding to the first electronic element, and a heat dissipation structure is disposed in the hollow area to thermally connect the first electronic element. Therefore, the heat energy generated by the first electronic element can be quickly dissipated to the outside via the heat dissipation structure, so as to avoid the problem of affecting the operation of the second electronic element due to the overheating of the encapsulation layer.
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公开(公告)号：US20240321672A1
公开(公告)日：2024-09-26
申请号：US18350839
申请日：2023-07-12
发明人： Cheng-Lun CHEN , Liang-Yi HUNG , Yu-Po WANG
IPC分类号： H01L23/367 , H01L21/48 , H01L23/00 , H01L25/16
CPC分类号： H01L23/3675 , H01L21/4871 , H01L24/16 , H01L24/32 , H01L24/73 , H01L25/162 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/1616 , H01L2924/16235 , H01L2924/16251 , H01L2924/1632 , H01L2924/3511
摘要： An electronic package and a manufacturing method thereof are provided, in which an electronic structure and a wall structure surrounding the electronic structure are disposed on a carrier structure, a heat conducting layer is formed on the electronic structure, and the wall structure and the heat conducting layer are covered by a heat dissipation element. Therefore, a thermal stress can be effectively dispersed by the arrangement of the wall structure, such that a warpage of the electronic structure and a heat dissipation body can be effectively controlled.
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公开(公告)号：US20240274495A1
公开(公告)日：2024-08-15
申请号：US18345753
申请日：2023-06-30
发明人： Shuai-Lin LIU , Nai-Hao KAO , Yu-Po WANG
IPC分类号： H01L23/367 , H01L21/48
CPC分类号： H01L23/3677 , H01L21/4871
摘要： An electronic package and a manufacturing method thereof are provided, in which a first electronic element and a second electronic element are embedded in a packaging layer, and a circuit structure is formed on the packaging layer and electrically connected to the first electronic element and the second electronic element, where the circuit structure has a heat dissipation portion thermally connected to the first electronic element. Therefore, the heat energy generated by the first electronic element can be quickly dissipated to the outside via the heat dissipation portion, so as to avoid the problem of affecting the operation of the second electronic element due to overheating of the packaging layer.
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公开(公告)号：US20240363577A1
公开(公告)日：2024-10-31
申请号：US18357596
申请日：2023-07-24
发明人： Pin-Jing SU , Wen-Yu TENG , Liang-Yi HUNG , Chia-Cheng CHEN , Yu-Po WANG
IPC分类号： H01L23/00 , H01L23/367
CPC分类号： H01L24/32 , H01L23/3675 , H01L24/16 , H01L24/33 , H01L24/73 , H01L2224/16225 , H01L2224/26145 , H01L2224/32225 , H01L2224/32245 , H01L2224/33519 , H01L2224/73204 , H01L2224/73253 , H01L2924/1611 , H01L2924/16235 , H01L2924/1632
摘要： An electronic package and a substrate structure thereof are provided, in which an electronic element and a flow stopper surrounding the electronic element are disposed on a substrate body of the substrate structure, and a heat dissipation structure is bonded on the electronic element via a heat dissipation material, so that the flow stopper limits an overflow range of the heat dissipation material to prevent the heat dissipation material from contaminating a circuit layer on the substrate body.
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公开(公告)号：US20240290701A1
公开(公告)日：2024-08-29
申请号：US18644953
申请日：2024-04-24
发明人： Yi-Min FU , Chi-Ching HO , Cheng-Yu KANG , Yu-Po WANG
IPC分类号： H01L23/498 , H01L21/48 , H01L23/00 , H01L23/367
CPC分类号： H01L23/49822 , H01L21/4857 , H01L21/486 , H01L23/367 , H01L23/49816 , H01L23/49833 , H01L23/49838 , H01L24/73 , H01L2224/73204 , H01L2924/3511
摘要： Provided is an electronic package providing a circuit structure having auxiliary circuit layers. Further, an electronic component is disposed on the circuit structure and electrically connected to the auxiliary circuit layers. In addition, an encapsulant covers the electronic component, and the circuit structure is disposed on the package substrate having a plurality of main circuit layers, such that the main circuit layers are electrically connected to the auxiliary circuit layers. As such, a number of layers of the auxiliary circuit layers is used to replace a layer number configuration of the main circuit layers.
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公开(公告)号：US20240274519A1
公开(公告)日：2024-08-15
申请号：US18643424
申请日：2024-04-23
发明人： Yi-Min FU , Chi-Ching HO , Cheng-Yu KANG , Yu-Po WANG
IPC分类号： H01L23/498 , H01L21/48 , H01L23/00 , H01L23/367
CPC分类号： H01L23/49822 , H01L21/4857 , H01L21/486 , H01L23/367 , H01L23/49816 , H01L23/49833 , H01L23/49838 , H01L24/73 , H01L2224/73204 , H01L2924/3511
摘要： Provided is an electronic package providing a circuit structure having auxiliary circuit layers. Further, an electronic component is disposed on the circuit structure and electrically connected to the auxiliary circuit layers. In addition, an encapsulant covers the electronic component, and the circuit structure is disposed on the package substrate having a plurality of main circuit layers, such that the main circuit layers are electrically connected to the auxiliary circuit layers. As such, a number of layers of the auxiliary circuit layers is used to replace a layer number configuration of the main circuit layers.
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