发明公开
US20240276691A1 MODULE
审中-公开
- 专利标题: MODULE
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申请号: US18643036申请日: 2024-04-23
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公开(公告)号: US20240276691A1公开(公告)日: 2024-08-15
- 发明人: Akio KATSUBE , Hideki SHINKAI
- 申请人: Murata Manufacturing Co., Ltd.
- 申请人地址: JP Kyoto-fu
- 专利权人: Murata Manufacturing Co., Ltd.
- 当前专利权人: Murata Manufacturing Co., Ltd.
- 当前专利权人地址: JP Kyoto-fu
- 优先权: JP 21183474 2021.11.10
- 主分类号: H05K9/00
- IPC分类号: H05K9/00
摘要:
A module includes a substrate, a first component, a sealing resin, and a shield film. The substrate is provided with a first surface. The first component is mounted on the first surface. The first component is sealed with the sealing resin at least from a lateral side. The first component is provided with an exposed surface. The exposed surface is exposed through the sealing resin on a side opposite to the substrate. The shield film is made of metal and covers the first component and the sealing resin. The shield film is provided with a first contact portion. The first contact portion is in contact with the exposed surface. The first contact portion includes a layer formed from a plurality of crystal grains. The plurality of crystal grains are different in longitudinal direction from one another when they are viewed from a direction orthogonal to the first surface.
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