公开(公告)号：US20240276691A1

公开(公告)日：2024-08-15

申请号：US18643036

申请日：2024-04-23

申请人： Murata Manufacturing Co., Ltd.

发明人： Akio KATSUBE ,  Hideki SHINKAI

IPC分类号： H05K9/00

CPC分类号： H05K9/0084 ,  H05K9/0015

摘要： A module includes a substrate, a first component, a sealing resin, and a shield film. The substrate is provided with a first surface. The first component is mounted on the first surface. The first component is sealed with the sealing resin at least from a lateral side. The first component is provided with an exposed surface. The exposed surface is exposed through the sealing resin on a side opposite to the substrate. The shield film is made of metal and covers the first component and the sealing resin. The shield film is provided with a first contact portion. The first contact portion is in contact with the exposed surface. The first contact portion includes a layer formed from a plurality of crystal grains. The plurality of crystal grains are different in longitudinal direction from one another when they are viewed from a direction orthogonal to the first surface.

公开(公告)号：US20200343152A1

公开(公告)日：2020-10-29

申请号：US16928090

申请日：2020-07-14

申请人： Murata Manufacturing Co., Ltd.

发明人： Yoshitaka MATSUKAWA ,  Yoichi TAKAGI ,  Akio KATSUBE ,  Yoshitaka ECHIKAWA

IPC分类号： H01L23/28 ,  H01L23/495 ,  H05K3/28 ,  H05K9/00 ,  H01L23/00

摘要： An electronic component package (100) includes a resin layer (40), an electronic component (10), a grounding member (30), and a conductor film (50). The grounding member (30) includes a multilayer body (31) and an outer conductor (32) disposed at an end portion of the multilayer body (31) in a lamination direction. The multilayer body (31) includes at least one resin film (31a) and at least one pattern conductor (31b) laminated one on another, and at least one via conductor (31c) extending in the lamination direction and connected to the outer conductor (32). In the multilayer body (31), at least one of the pattern conductor (31b) has at least part of a circumference connected to a conductor film (50) and electrically connected to the via conductor (31c). Part of an external terminal and part of the outer conductor (32) are exposed from an identical surface of the resin layer (40).

公开(公告)号：US20220110211A1

公开(公告)日：2022-04-07

申请号：US17644446

申请日：2021-12-15

申请人： Murata Manufacturing Co., Ltd.

发明人： Akio KATSUBE

IPC分类号： H05K1/14 ,  H01L23/12 ,  H05K1/02

摘要： A module includes: a wiring board as a ceramic board having a first main surface; a first component and a second component that are mounted on the first main surface; at least one conductive member disposed on the first main surface between the first component and the second component; a sealing resin that seals the first component, the second component, and the conductive member; and a shield film that covers an upper surface and a side surface of the sealing resin and a side surface of the wiring board. The shield film is electrically connected to a ground conductor. The conductive member is formed by firing simultaneously with the wiring board, and electrically connected to the ground conductor and electrically connected to the shield film.

公开(公告)号：US20160189866A1

公开(公告)日：2016-06-30

申请号：US15065391

申请日：2016-03-09

申请人： MURATA MANUFACTURING CO., LTD.

发明人： Shunsuke KITAMURA ,  Akio KATSUBE

IPC分类号： H01G4/232 ,  H01F41/32 ,  H03H3/007 ,  H01G13/00

CPC分类号： H01G4/2325 ,  B41N1/24 ,  H01F41/32 ,  H01G4/30 ,  H01G13/006 ,  H03H3/007

摘要： A method for forming an external electrode of an electronic component, which can apply sufficient conductive paste to even an end, and is able to enhance reliability as an electronic component. In the method for forming an external electrode of an electronic component, a conductive paste is applied to a printing target through a metal mask composed of a hole and a mesh portion disposed to surround the outer perimeter of the hole. The metal mask has the outer perimeter of the hole located inside a printing region of the printing target, and the outer perimeter of the mesh portion is located outside the printing region of the printing target.

摘要翻译： 一种用于形成电子部件的外部电极的方法，其可以将足够的导电浆料均匀地施加到一端，并且能够提高作为电子部件的可靠性。 在形成电子部件的外部电极的方法中，通过由围绕孔的外周设置的孔和网孔构成的金属掩模，将导电性糊剂施加到印刷对象物上。 金属掩模具有位于打印目标的打印区域内的孔的外周边，并且网部的外周位于打印对象的打印区域的外部。

公开(公告)号：US20210204395A1

公开(公告)日：2021-07-01

申请号：US17198489

申请日：2021-03-11

申请人： Murata Manufacturing Co., Ltd.

发明人： Issei YAMAMOTO ,  Akio KATSUBE

IPC分类号： H05K1/02 ,  H05K1/18 ,  H05K5/00

摘要： An electronic component module (100) includes a module board (10) having electronic components (40) mounted on at least one of a first surface (front surface) (12) and a second surface (back surface) (14), mold portions (22 and 23), and a shield (32). The mold portions (22 and 23) cover the mounted electronic components (40). The shield (32) covers at least a part of the mold portions (22 and 23) and the side surfaces of the module board (10). Protrusions (15) protruding from the side surfaces are formed on the module board (10). The shield (32) is separated by the protrusions (15).

公开(公告)号：US20240266240A1

公开(公告)日：2024-08-08

申请号：US18640076

申请日：2024-04-19

申请人： Murata Manufacturing Co., Ltd.

发明人： Akio KATSUBE ,  Hideki SHINKAI

IPC分类号： H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L23/544 ,  H01L23/552 ,  H01L25/065 ,  H01L25/16 ,  H03H3/02 ,  H03H3/08 ,  H03H9/02 ,  H03H9/05 ,  H03H9/08 ,  H03H9/10

CPC分类号： H01L23/3185 ,  H01L21/561 ,  H01L23/552 ,  H03H3/02 ,  H03H3/08 ,  H03H9/02086 ,  H03H9/02913 ,  H03H9/0523 ,  H03H9/0542 ,  H03H9/059 ,  H03H9/08 ,  H03H9/1042 ,  H03H9/1085 ,  H01L23/544 ,  H01L24/16 ,  H01L25/0655 ,  H01L25/16 ,  H01L2223/54486 ,  H01L2224/16227

摘要： A module includes a substrate, a first component, and a sealing resin. The substrate is provided with a first surface. The first component is mounted on the first surface. The first component is sealed with the sealing resin at least from a lateral side. The first component includes a projecting portion. The projecting portion projects from the sealing resin on a side opposite to a side of the substrate.

公开(公告)号：US20220102255A1

公开(公告)日：2022-03-31

申请号：US17643672

申请日：2021-12-10

申请人： Murata Manufacturing Co., Ltd.

发明人： Hideki SHINKAI ,  Akio KATSUBE

IPC分类号： H01L23/498 ,  H01L25/16 ,  H01L23/31 ,  H01L23/66

摘要： An electronic component module includes a substrate, a connector, an electronic component, a conductor wall, an insulating resin, and a conductive shield film. The connector and the electronic component are mounted on a first main surface of the substrate. The conductor wall has a cylindrical shape, is mounted on the first main surface of the substrate, and includes an interior space in which the connector is disposed. The insulating resin is provided on the first main surface. The conductive shield film is provided on a surface of the insulating resin. The insulating resin covers the electronic component and is disposed outside the conductor wall except the interior space of the conductor wall.

公开(公告)号：US20130294034A1

公开(公告)日：2013-11-07

申请号：US13936007

申请日：2013-07-05

申请人： MURATA MANUFACTURING CO., LTD.

发明人： Koichi KANRYO ,  Akio KATSUBE ,  Shunsuke KITAMURA

IPC分类号： H05K3/30 ,  H05K1/18

CPC分类号： H05K3/301 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/552 ,  H01L24/16 ,  H01L24/97 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/81005 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/15159 ,  H01L2924/15313 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/185 ,  H05K3/0052 ,  H05K3/284 ,  H05K9/0045 ,  H05K2201/0715 ,  H05K2201/0909 ,  H05K2203/302 ,  Y10T29/49146 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2924/014 ,  H01L2924/00

摘要： A method of manufacturing an electronic component module includes sealing a surface of an aggregate substrate on which a plurality of electronic components are mounted with a sealing resin and cutting boundary portions between electronic component modules from an outer surface of the sealing resin to a position at least partially through the aggregate substrate to form first grooves. A shield layer is formed by coating the outer surface of the sealing resin with a conductive resin and filling the first grooves with the conductive resin, and recesses are formed at positions on the shield layer where the first grooves are formed. The boundary portions between electronic component modules are cut along the corresponding recesses so that second grooves each having a width smaller than the width of a corresponding one of the recesses are formed, and the aggregate substrate is singulated into the individual electronic component modules.

摘要翻译： 一种电子部件模块的制造方法，其特征在于，使用密封树脂密封其上安装有多个电子部件的集合基板的表面，将密封树脂的外表面的电子部件模块之间的边界部分切断至至少 部分地通过聚集基底以形成第一凹槽。 通过用导电树脂涂覆密封树脂的外表面并用导电树脂填充第一凹槽来形成屏蔽层，并且在形成有第一凹槽的屏蔽层上形成凹部。 电子部件模块之间的边界部分沿对应的凹部被切割，从而形成宽度小于相应的一个凹槽的宽度的第二凹槽，并且将聚集基片分割成各个电子部件模块。