Invention Publication
- Patent Title: SINTERED MATERIAL, METAL SINTERED COMPACT, METHOD FOR PRODUCING SINTERED MATERIAL, METHOD FOR PRODUCING JOINED BODY, AND JOINED BODY
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Application No.: US18643068Application Date: 2024-04-23
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Publication No.: US20240278321A1Publication Date: 2024-08-22
- Inventor: Takuya SEKIGUCHI , Chuantong CHEN , Katsuaki SUGANUMA
- Applicant: TOPPAN Holdings Inc. , OSAKA UNIVERSITY
- Applicant Address: JP Tokyo
- Assignee: TOPPAN Holdings Inc.,OSAKA UNIVERSITY
- Current Assignee: TOPPAN Holdings Inc.,OSAKA UNIVERSITY
- Current Assignee Address: JP Tokyo; JP Osaka
- Priority: JP 21173794 2021.10.25 JP 22161807 2022.10.06
- Main IPC: B22F7/06
- IPC: B22F7/06 ; B22F1/00 ; B22F1/052 ; B22F1/054 ; B22F3/10 ; B22F3/24 ; B22F9/24
Abstract:
A sintered material containing silver particles, copper particles, a nitrogen-containing compound, and a reducing agent, in which a primary particle diameter of the silver particles is 200 nm or less, and a volume-based 50% cumulative particle diameter of the copper particles, as measured by laser diffraction/scattering particle diameter distribution measurement, is 1 μm or more.
Information query
