公开(公告)号：US20240278321A1

公开(公告)日：2024-08-22

申请号：US18643068

申请日：2024-04-23

Applicant: TOPPAN Holdings Inc. ,  OSAKA UNIVERSITY

Inventor： Takuya SEKIGUCHI ,  Chuantong CHEN ,  Katsuaki SUGANUMA

IPC: B22F7/06 ,  B22F1/00 ,  B22F1/052 ,  B22F1/054 ,  B22F3/10 ,  B22F3/24 ,  B22F9/24

CPC classification number: B22F7/062 ,  B22F1/052 ,  B22F1/056 ,  B22F1/09 ,  B22F3/10 ,  B22F9/24 ,  B22F2003/248 ,  B22F2301/10 ,  B22F2301/255 ,  B22F2304/10 ,  B22F2998/10 ,  B22F2999/00

Abstract: A sintered material containing silver particles, copper particles, a nitrogen-containing compound, and a reducing agent, in which a primary particle diameter of the silver particles is 200 nm or less, and a volume-based 50% cumulative particle diameter of the copper particles, as measured by laser diffraction/scattering particle diameter distribution measurement, is 1 μm or more.