Invention Publication
- Patent Title: ELECTRONIC DEVICE INCLUDING MODULE ASSEMBLY
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Application No.: US18624262Application Date: 2024-04-02
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Publication No.: US20240288834A1Publication Date: 2024-08-29
- Inventor: Taegyun KIM , Junghyun KANG , Kijung KIM , Shinhun MOON , Seunghyun CHO , Seongho HONG
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Priority: KR 20210042589 2021.04.01
- Main IPC: G04G19/00
- IPC: G04G19/00 ; A61B5/00 ; A61B5/024 ; G04G9/00 ; G04G21/02 ; H02J7/00 ; H02J50/00 ; H02J50/10 ; H05K1/02 ; H05K5/00

Abstract:
An electronic device is disclosed, including a housing having a front plate, a back plate facing the front plate, and a side frame surrounding a space defined between the front and back plates, a circuit board disposed within the housing, a module assembly disposed between the circuit board and the back plate, and electrically connected with the circuit board, wherein the module assembly includes: an optical sensor module including a flexible printed circuit board (FPCB) including a first surface and a second surface facing away from the first surface, a light emitting part disposed on the first surface of the FPCB, and a light receiving part disposed on the first surface spaced apart from the light emitting part, and a wireless charging module surrounding the FPCB of the optical sensor module, and at least partially coupled to the FPCB so as to be integrated with the FPCB.
Information query