ELECTRONIC DEVICE INCLUDING MODULE ASSEMBLY

    公开(公告)号:US20220330439A1

    公开(公告)日:2022-10-13

    申请号:US17708295

    申请日:2022-03-30

    Abstract: An electronic device is disclosed, including a housing having a front plate, a back plate facing the front plate, and a side frame surrounding a space defined between the front and back plates, a circuit board disposed within the housing, a module assembly disposed between the circuit board and the back plate, and electrically connected with the circuit board, wherein the module assembly includes: an optical sensor module including a flexible printed circuit board (FPCB) including a first surface and a second surface facing away from the first surface, a light emitting part disposed on the first surface of the FPCB, and a light receiving part disposed on the first surface spaced apart from the light emitting part, and a wireless charging module surrounding the FPCB of the optical sensor module, and at least partially coupled to the FPCB so as to be integrated with the FPCB.

    ELECTRONIC DEVICE INCLUDING PHOTOSENSOR MODULE

    公开(公告)号:US20220187869A1

    公开(公告)日:2022-06-16

    申请号:US17685228

    申请日:2022-03-02

    Abstract: An electronic device according to various embodiments of the present disclosure may comprise: a housing including a front plate facing forward and a rear plate facing rearward; a display assembly comprising a display visible through at least a portion of the front plate and which includes an upper portion, a lower portion overlapping at least a partial region of the upper assembly and that includes a first opening, and a flexible circuit board overlapping at least a partial region of the lower portion and that includes a second opening corresponding to at least a portion of the first opening; a photosensor module including a sensing unit comprising a sensor corresponding to at least a portion of the second opening, and a plurality of pads arranged to be adjacent to the sensing unit and electrically coupled to the flexible circuit board; and an electrical component and/or mechanical structure arranged between the photosensor module and the rear plate and spaced from the photosensor module at a first distance.

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