An electronic package and method of manufacture are provided. The electronic package has a substrate panel, an electronic module mounted to a surface of the substrate panel, and a plurality of electrically conductive contact pads arranged on the surface of the substrate panel. The electronic module includes a group of electrically conductive nodes. A predetermined one of the plurality of electrically conductive contact pads is associated with the group of electrically conductive nodes. The group of electrically conductive nodes is coupled to a corresponding group of spatially distinct fusion areas of the predetermined electrically conductive contact pad by corresponding intermediate solder portions. A solder masking arrangement extends over a part of the surface of the substrate panel. The masking arrangement is arranged over the predetermined electrically conductive contact pad and configured to at least partially define the group of spatially distinct fusion areas.