Invention Publication
- Patent Title: SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
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Application No.: US18668988Application Date: 2024-05-20
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Publication No.: US20240304629A1Publication Date: 2024-09-12
- Inventor: Toshio HINO
- Applicant: Socionext Inc.
- Applicant Address: JP Kanagawa
- Assignee: Socionext Inc.
- Current Assignee: Socionext Inc.
- Current Assignee Address: JP Kanagawa
- Priority: JP 21193046 2021.11.29
- Main IPC: H01L27/092
- IPC: H01L27/092 ; H01L23/528 ; H01L27/02

Abstract:
In a standard cell of a semiconductor integrated circuit device, a metal interconnect corresponding to an input node is connected to the gates of first and second transistors, and a metal interconnect corresponding to an output node is connected to the drains of third and fourth transistors. A metal interconnect corresponding to an intermediate node is connected to a gate interconnect corresponding to the gates of the third and fourth transistors through a gate contact. The gate contact is placed at a position overlapping the third transistor in planar view.
Information query
IPC分类: