Invention Publication
- Patent Title: PATTERN SHAPE MEASUREMENT METHOD, PATTERN SHAPE MEASUREMENT DEVICE, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
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Application No.: US18593000Application Date: 2024-03-01
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Publication No.: US20240310167A1Publication Date: 2024-09-19
- Inventor: Kazuki HAGIHARA
- Applicant: Kioxia Corporation
- Applicant Address: JP Tokyo
- Assignee: Kioxia Corporation
- Current Assignee: Kioxia Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP 23043129 2023.03.17
- Main IPC: G01B15/04
- IPC: G01B15/04 ; G06T7/00 ; G06T7/543 ; H10B80/00

Abstract:
A pattern shape measurement method includes acquiring image data of a target pattern obtained by irradiating an observation region of a sample with a charged particle or an electromagnetic wave, generating first contour point group data in which location information of a contour point of the target pattern extracted based on the image data and an index related to an orientation angle of a line connecting a center of the target pattern and the contour point from a reference line passing through the center of the target pattern are associated with each other, and generating, based on a weighting table in which the index and weight determined based on a standard deviation of location information of the contour point of the target pattern present in a direction of the orientation angle are associated with each other and stored, and the first contour point group data, second contour point group data according to the weight.
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